Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649507 | Dual layer photoresist method for fabricating a mushroom bumping plating structure | Yen-Ming Chen, Cheng-Yu Chu, Chiou-Shian Peng, Yang-Tung Fan, Fu-Jier Fan +1 more | 2003-11-18 |
| 6632700 | Method to form a color image sensor cell while protecting the bonding pad structure from damage | Yang-Tung Fan, Cheng-Yu Chu, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen +1 more | 2003-10-14 |
| 6605524 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2003-08-12 |
| 6586323 | Method for dual-layer polyimide processing on bumping technology | Fu-Jier Fan, Cheng-Yu Chu, Shih-Jang Lin, Yang-Tung Fan, Chiou-Shian Peng | 2003-07-01 |
| 6583039 | Method of forming a bump on a copper pad | Yen-Ming Chen, Cheng-Yu Chu, Yang-Tung Fan, Fu-Jier Fan, Shih-Jane Lin +2 more | 2003-06-24 |
| 6534396 | Patterned conductor layer pasivation method with dimensionally stabilized planarization | Fu-Jier Fahn, James Chieh-Tsung Chen, Eugene Cheu, Chien-Shian Peng, Gilbert Fan +1 more | 2003-03-18 |