Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649507 | Dual layer photoresist method for fabricating a mushroom bumping plating structure | Yen-Ming Chen, Cheng-Yu Chu, Kuo-Wei Lin, Chiou-Shian Peng, Fu-Jier Fan +1 more | 2003-11-18 |
| 6632700 | Method to form a color image sensor cell while protecting the bonding pad structure from damage | Cheng-Yu Chu, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2003-10-14 |
| 6605524 | Bumping process to increase bump height and to create a more robust bump structure | Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng, Yen-Ming Chen +1 more | 2003-08-12 |
| 6586323 | Method for dual-layer polyimide processing on bumping technology | Fu-Jier Fan, Cheng-Yu Chu, Kuo-Wei Lin, Shih-Jang Lin, Chiou-Shian Peng | 2003-07-01 |
| 6583039 | Method of forming a bump on a copper pad | Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin +2 more | 2003-06-24 |