Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638688 | Selective electroplating method employing annular edge ring cathode electrode contact | Sheng-Liang Pan, Hao-Wei Chang, Chun-Hong Chang, Yen-Ming Chen | 2003-10-28 |
| 6636313 | Method of measuring photoresist and bump misalignment | Yen-Ming Chen, Chia-Fu Lin, Chao-Yuan Su, Hsin-Hui Lee, Li-Chih Chen | 2003-10-21 |
| 6623912 | Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresist | Yu-Kung Hsiao, Sheng-Liang Pan, Kuo-Liang Lu | 2003-09-23 |
| 6602775 | Method to improve reliability for flip-chip device for limiting pad design | Yen-Ming Chen, Chia-Fu Lin, Hsin-Hui Lee, Chao-Yuan Su, Li-Chi Chen | 2003-08-05 |