Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660641 | Method for forming crack resistant planarizing layer within microelectronic fabrication | Chin-Chen Kuo, Yu-Kung Hsiao, Chih-Kung Chang, Fu-Tien Wong, Chung-Sheng Hsiung | 2003-12-09 |
| 6638688 | Selective electroplating method employing annular edge ring cathode electrode contact | Kai-Ming Ching, Hao-Wei Chang, Chun-Hong Chang, Yen-Ming Chen | 2003-10-28 |
| 6623912 | Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresist | Kai-Ming Ching, Yu-Kung Hsiao, Kuo-Liang Lu | 2003-09-23 |
| 6586322 | Method of making a bump on a substrate using multiple photoresist layers | Chih-Cheng Chiu, Kuo-Liang Lu | 2003-07-01 |
| 6582988 | Method for forming micro lens structures | Yu-Kung Hsiao, Bii-Junq Chang | 2003-06-24 |