Issued Patents 2003
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656402 | Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing | Hugh E. Stroupe, Brian F. Gordon | 2003-12-02 |
| 6653722 | Method for applying uniform pressurized film across wafer | Hugh E. Stroupe, Lynn J. Carroll | 2003-11-25 |
| 6652764 | Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates | — | 2003-11-25 |
| 6645345 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Hugh E. Stroupe, Brian F. Gordon | 2003-11-11 |
| 6624089 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Hugh E. Stroupe, Brian F. Gordon | 2003-09-23 |
| 6617206 | Method of forming a capacitor structure | Gurtej S. Sandhu | 2003-09-09 |
| 6617256 | Method for controlling the temperature of a gas distribution plate in a process reactor | Kevin G. Donohoe | 2003-09-09 |
| 6613189 | Apparatus for controlling the temperature of a gas distribution plate in a process reactor | Kevin G. Donohoe | 2003-09-02 |
| 6596647 | Dilute cleaning composition and method for using the same | Max Hineman | 2003-07-22 |
| 6565721 | Use of heavy halogens for enhanced facet etching | Kevin G. Donohoe | 2003-05-20 |
| 6537922 | Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby | Kei-Yu Ko, Li Li | 2003-03-25 |
| 6518172 | Method for applying uniform pressurized film across wafer | Hugh E. Stroupe, Lynn J. Carroll | 2003-02-11 |
| 6516742 | Apparatus for improved low pressure inductively coupled high density plasma reactor | Kevin G. Donohoe | 2003-02-11 |
| 6506679 | Deadhesion method and mechanism for wafer processing | Hugh E. Stroupe, Brian F. Gordon | 2003-01-14 |
| 6503410 | Method of modifying an RF circuit of a plasma chamber to increase chamber life and process capabilities | Kevin G. Donohoe | 2003-01-07 |