Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656402 | Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Brian F. Gordon | 2003-12-02 |
| 6653722 | Method for applying uniform pressurized film across wafer | Guy T. Blalock, Lynn J. Carroll | 2003-11-25 |
| 6645345 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Brian F. Gordon | 2003-11-11 |
| 6624089 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Brian F. Gordon | 2003-09-23 |
| 6610610 | Methods for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon | 2003-08-26 |
| 6555897 | Assembly for attaching die to leads | — | 2003-04-29 |
| 6530113 | Apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon | 2003-03-11 |
| 6518172 | Method for applying uniform pressurized film across wafer | Guy T. Blalock, Lynn J. Carroll | 2003-02-11 |
| 6506679 | Deadhesion method and mechanism for wafer processing | Guy T. Blalock, Brian F. Gordon | 2003-01-14 |