Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656402 | Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Hugh E. Stroupe | 2003-12-02 |
| 6645345 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Hugh E. Stroupe | 2003-11-11 |
| 6631798 | Printed circuit board support | Tony Teitenberg, John S. Godfrey | 2003-10-14 |
| 6624089 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Hugh E. Stroupe | 2003-09-23 |
| 6610610 | Methods for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Hugh E. Stroupe, Todd A. Dobson | 2003-08-26 |
| 6569241 | Substrate spinning apparatus | Paul D. Shirley | 2003-05-27 |
| 6555276 | Substrate coating and semiconductor processing method of improving uniformity of liquid deposition | Paul D. Shirley | 2003-04-29 |
| 6530113 | Apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Hugh E. Stroupe, Todd A. Dobson | 2003-03-11 |
| 6506679 | Deadhesion method and mechanism for wafer processing | Guy T. Blalock, Hugh E. Stroupe | 2003-01-14 |