Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664190 | Pre STI-CMP planarization scheme | Cheng-Hou Loh, Paul Proctor | 2003-12-16 |
| 6613648 | Shallow trench isolation using TEOS cap and polysilicon pullback | Seng-Keong Victor Lim, Kong Hean Lee, Wang Ling Goh | 2003-09-02 |
| 6613649 | Method for buffer STI scheme with a hard mask layer as an oxidation barrier | Seng-Keong Victor Lim, Alex See, Wang Ling Goh | 2003-09-02 |
| 6528886 | Intermetal dielectric layer for integrated circuits | Huang Liu, John Sudijono, Juan Boon Tan, Edwin Goh, Alan Cuthbertson +3 more | 2003-03-04 |