Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6613648 | Shallow trench isolation using TEOS cap and polysilicon pullback | Seng-Keong Victor Lim, Feng Chen, Kong Hean Lee | 2003-09-02 |
| 6613649 | Method for buffer STI scheme with a hard mask layer as an oxidation barrier | Seng-Keong Victor Lim, Feng Chen, Alex See | 2003-09-02 |
| 6613652 | Method for fabricating SOI devices with option of incorporating air-gap feature for better insulation and performance | Yeow Kheng Lim, Randall Cher Liang Cha, Alex See, Tae Jong Lee | 2003-09-02 |
| 6558994 | Dual silicon-on-insulator device wafer die | Randall Cher Liang Cha, Yeow Kheng Lim, Alex See, Tae Jong Lee | 2003-05-06 |