Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6559033 | Processing for forming integrated circuit structure with low dielectric constant material between closely spaced apart metal lines | John Hu, Senthil Arthanari, Hong-Qiang Lu | 2003-05-06 |
| 6559048 | Method of making a sloped sidewall via for integrated circuit structure to suppress via poisoning | Yong-Bae Kim, Philippe Schoenborn | 2003-05-06 |
| 6503840 | Process for forming metal-filled openings in low dielectric constant dielectric material while inhibiting via poisoning | Wilbur G. Catabay, Wei-Jen Hsia, Hong-Qiang Lu, Yong-Bae Kim, Kiran Kumar +2 more | 2003-01-07 |