Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6559033 | Processing for forming integrated circuit structure with low dielectric constant material between closely spaced apart metal lines | John Hu, Kai Zhang, Senthil Arthanari | 2003-05-06 |
| 6503840 | Process for forming metal-filled openings in low dielectric constant dielectric material while inhibiting via poisoning | Wilbur G. Catabay, Wei-Jen Hsia, Yong-Bae Kim, Kiran Kumar, Kai Zhang +2 more | 2003-01-07 |