Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6613665 | Process for forming integrated circuit structure comprising layer of low k dielectric material having antireflective properties in an upper surface | Wei-Jen Hsia | 2003-09-02 |
| 6537896 | Process for treating porous low k dielectric material in damascene structure to form a non-porous dielectric diffusion barrier on etched via and trench surfaces in the porous low k dielectric material | Wei-Jen Hsia | 2003-03-25 |
| 6528423 | PROCESS FOR FORMING COMPOSITE OF BARRIER LAYERS OF DIELECTRIC MATERIAL TO INHIBIT MIGRATION OF COPPER FROM COPPER METAL INTERCONNECT OF INTEGRATED CIRCUIT STRUCTURE INTO ADJACENT LAYER OF LOW K DIELECTRIC MATERIAL | Wei-Jen Hsia | 2003-03-04 |
| 6518193 | Substrate processing system | Kiran Kumar, Zhihai Wang, Rudy Rios, Richard Schinella | 2003-02-11 |
| 6503840 | Process for forming metal-filled openings in low dielectric constant dielectric material while inhibiting via poisoning | Wei-Jen Hsia, Hong-Qiang Lu, Yong-Bae Kim, Kiran Kumar, Kai Zhang +2 more | 2003-01-07 |