Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6440861 | Method of forming dual damascene structure | Jui-Tsen Huang, Yi-Fang Cheng, Ming-Sheng Yang | 2002-08-27 |
| 6410106 | Method of forming an intermetal dielectric layer | Cheng-Yuan Tsai, Ming-Sheng Yang | 2002-06-25 |
| 6410446 | Method for gap filling | Cheng-Yuan Tsai, Ming-Sheng Yang | 2002-06-25 |
| 6387813 | Method for stripping a low dielectric film with high carbon content | Neng-Hui Yang, Ming-Sheng Yang | 2002-05-14 |
| 6376394 | Method of forming inter-metal dielectric layer | Cheng-Yuan Tsai, Ming-Sheng Yang | 2002-04-23 |
| 6352918 | Method of forming inter-metal interconnection | Yimin Huang, Tri-Rung Yew | 2002-03-05 |
| 6339025 | Method of fabricating a copper capping layer | Kun-Chih Wang, Wen-Yi Hsieh, Yimin Huang | 2002-01-15 |