Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6371045 | Physical vapor deposition device for forming a metallic layer on a semiconductor wafer | Chao-Ching Hsieh | 2002-04-16 |
| 6348398 | Method of forming pad openings and fuse openings | — | 2002-02-19 |
| 6339025 | Method of fabricating a copper capping layer | Chih-Chien Liu, Wen-Yi Hsieh, Yimin Huang | 2002-01-15 |