Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6388326 | Bonding pad on a semiconductor chip | Hermen Liu | 2002-05-14 |
| 6372621 | Method of forming a bonding pad on a semiconductor chip | Hermen Liu | 2002-04-16 |
| 6352918 | Method of forming inter-metal interconnection | Chih-Chien Liu, Tri-Rung Yew | 2002-03-05 |
| 6339025 | Method of fabricating a copper capping layer | Chih-Chien Liu, Kun-Chih Wang, Wen-Yi Hsieh | 2002-01-15 |