Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6455943 | Bonding pad structure of semiconductor device having improved bondability | Shing-Ren Sheu | 2002-09-24 |
| 6424025 | Cross grid array package structure and method of manufacture | — | 2002-07-23 |
| 6388326 | Bonding pad on a semiconductor chip | Yimin Huang | 2002-05-14 |
| 6372621 | Method of forming a bonding pad on a semiconductor chip | Yimin Huang | 2002-04-16 |