Issued Patents 2002
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492731 | Composite low dielectric constant film for integrated circuit structure | Wei-Jen Hsia, Kai Zhang | 2002-12-10 |
| 6472314 | Diamond barrier layer | Zhihai Wang | 2002-10-29 |
| 6423628 | Method of forming integrated circuit structure having low dielectric constant material and having silicon oxynitride caps over closely spaced apart metal lines | Weidan Li, Wei-Jen Hsia | 2002-07-23 |
| 6423630 | Process for forming low K dielectric material between metal lines | Wei-Jen Hsia, Dung-Ching Perng | 2002-07-23 |
| 6420277 | Process for inhibiting crack formation in low dielectric constant dielectric films of integrated circuit structure | Wei-Jen Hsia, Hong Qiang | 2002-07-16 |
| 6391795 | Low k dielectric composite layer for intergrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning | Richard Schinella | 2002-05-21 |
| 6368979 | Process for forming trenches and vias in layers of low dielectric constant carbon-doped silicon oxide dielectric material of an integrated circuit structure | Zhihai Wang, Joe W. Zhao | 2002-04-09 |
| 6350700 | Process for forming trenches and vias in layers of low dielectric constant carbon-doped silicon oxide dielectric material of an integrated circuit structure | Richard Schinella, Philippe Schoenborn | 2002-02-26 |
| 6346490 | Process for treating damaged surfaces of low k carbon doped silicon oxide dielectric material after plasma etching and plasma cleaning steps | Wei-Jen Hsia, Alex Kabansky | 2002-02-12 |