Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6423628 | Method of forming integrated circuit structure having low dielectric constant material and having silicon oxynitride caps over closely spaced apart metal lines | Wilbur G. Catabay, Wei-Jen Hsia | 2002-07-23 |
| 6391768 | Process for CMP removal of excess trench or via filler metal which inhibits formation of concave regions on oxide surface of integrated circuit structure | Dawn M. Lee, Jayanthi Pallinti, Ming-Yi Lee | 2002-05-21 |