Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489242 | Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structures | Ronald J. Nagahara, Jayanthi Pallinti | 2002-12-03 |
| 6391768 | Process for CMP removal of excess trench or via filler metal which inhibits formation of concave regions on oxide surface of integrated circuit structure | Jayanthi Pallinti, Weidan Li, Ming-Yi Lee | 2002-05-21 |