Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6460265 | Double-sided wafer exposure method and device | Christopher P. Ausschnitt | 2002-10-08 |
| 6444560 | Process for making fine pitch connections between devices and structure made by the process | Chandrika Prasad, Roy Yu | 2002-09-03 |
| 6429045 | Structure and process for multi-chip chip attach with reduced risk of electrostatic discharge damage | Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, David V. Horak, Edmund J. Sprogis +1 more | 2002-08-06 |
| 6355501 | Three-dimensional chip stacking assembly | Ka-Hing Fung | 2002-03-12 |