Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6452265 | Multi-chip module utilizing a nonconductive material surrounding the chips that has a similar coefficient of thermal expansion | Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, David V. Horak, Rosemary A. Previti-Kelly | 2002-09-17 |
| 6429045 | Structure and process for multi-chip chip attach with reduced risk of electrostatic discharge damage | Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, David V. Horak, H. Bernhard Pogge +1 more | 2002-08-06 |