Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6475356 | Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma | Ken Ngan, Simon Wing-Lok Hui | 2002-11-05 |
| 6472867 | Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life | Murali Abburi | 2002-10-29 |
| 6455921 | Fabricating plug and near-zero overlap interconnect line | Jaim Nulman | 2002-09-24 |
| 6436207 | Manufacture of target for use in magnetron sputtering of nickel and like magnetic metals for forming metallization films having consistent uniformity through life | Murali Abburi | 2002-08-20 |
| 6420260 | Ti/Tinx underlayer which enables a highly <111> oriented aluminum interconnect | Kenny King-Tai Ngan | 2002-07-16 |
| 6391163 | Method of enhancing hardness of sputter deposited copper films | Vikram Pavate, Murali Abburi, Murali Narasimhan | 2002-05-21 |