Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472867 | Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life | Seshadri Ramaswami | 2002-10-29 |
| 6436207 | Manufacture of target for use in magnetron sputtering of nickel and like magnetic metals for forming metallization films having consistent uniformity through life | Seshadri Ramaswami | 2002-08-20 |
| 6391163 | Method of enhancing hardness of sputter deposited copper films | Vikram Pavate, Murali Narasimhan, Seshadri Ramaswami | 2002-05-21 |
| 6352620 | Staged aluminum deposition process for filling vias | Sang Ho Yu, Yonghwa Chris Cha, Shri Singhvi, Fufa Chen | 2002-03-05 |