Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6426282 | Method of forming solder bumps on a semiconductor wafer | Dinesh Saigal, Shankarram Athreya, Lisa Yang | 2002-07-30 |
| 6420260 | Ti/Tinx underlayer which enables a highly <111> oriented aluminum interconnect | Seshadri Ramaswami | 2002-07-16 |
| 6372301 | Method of improving adhesion of diffusion layers on fluorinated silicon dioxide | Murali Narasimhan, Vikram Pavate, Xiangbing Li | 2002-04-16 |
| 6346489 | Precleaning process for metal plug that minimizes damage to low-&kgr; dielectric | Barney M. Cohen, Suraj Rengarajan | 2002-02-12 |