LY

Lisa Yang

Applied Materials: 1 patents #371 of 912Top 45%
📍 San Jose, CA: #851 of 2,494 inventorsTop 35%
🗺 California: #8,284 of 26,763 inventorsTop 35%
Overall (2002): #166,674 of 266,432Top 65%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6426282 Method of forming solder bumps on a semiconductor wafer Dinesh Saigal, Shankarram Athreya, Kenny King-Tai Ngan 2002-07-30