Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489240 | Method for forming copper interconnects | John A. Iacoponi, Paul R. Besser, Frederick N. Hause, Frank Mauersberger, Errol Todd Ryan +1 more | 2002-12-03 |
| 6413846 | Contact each methodology and integration scheme | Paul R. Besser, Errol Todd Ryan, Frederick N. Hause, Frank Mauersberger, John A. Iacoponi +1 more | 2002-07-02 |
| 6395100 | Method of improving vacuum quality in semiconductor processing chambers | Willie Rivera | 2002-05-28 |
| 6376330 | Dielectric having an air gap formed between closely spaced interconnect lines | H. Jim Fulford, Robert Dawson, Fred N. Hause, Basab Bandyopadhyay, Mark W. Michael | 2002-04-23 |
| 6353253 | Semiconductor isolation region bounded by a trench and covered with an oxide to improve planarization | Fred N. Hause, Basab Bandyopadhyay, H. Jim Fulford, Robert Dawson, Mark W. Michael | 2002-03-05 |