Issued Patents 2002
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489683 | Variable grain size in conductors for semiconductor vias and trenches | Sergey Lopatin | 2002-12-03 |
| 6489240 | Method for forming copper interconnects | Paul R. Besser, Frederick N. Hause, Frank Mauersberger, Errol Todd Ryan, William S. Brennan +1 more | 2002-12-03 |
| 6468889 | Backside contact for integrated circuit and method of forming same | John C. Miethke | 2002-10-22 |
| 6448099 | Method and apparatus for detecting voltage contrast in a semiconductor wafer | Tom Spikes, Jr., John C. Miethke | 2002-09-10 |
| 6413846 | Contact each methodology and integration scheme | Paul R. Besser, Errol Todd Ryan, Frederick N. Hause, Frank Mauersberger, William S. Brennan +1 more | 2002-07-02 |
| 6362526 | Alloy barrier layers for semiconductors | Shekhar Pramanick | 2002-03-26 |
| 6346472 | Manufacturing method for semiconductor metalization barrier | Sergey Lopatin | 2002-02-12 |
| 6344691 | Barrier materials for metal interconnect in a semiconductor device | Shekhar Pramanick | 2002-02-05 |
| 6340633 | Method for ramped current density plating of semiconductor vias and trenches | Sergey Lopatin | 2002-01-22 |