Issued Patents 2002
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6368965 | Method for low stress plating of semiconductor vias and channels | — | 2002-04-09 |
| 6368961 | Graded compound seed layers for semiconductors | Takeshi Nogami | 2002-04-09 |
| 6358848 | Method of reducing electromigration in copper lines by forming an interim layer of calcium-doped copper seed layer in a chemical solution and semiconductor device thereby formed | — | 2002-03-19 |
| 6350687 | Method of fabricating improved copper metallization including forming and removing passivation layer before forming capping film | Steven C. Avanzino, Kai Yang, Todd P. Lukanc | 2002-02-26 |
| 6348732 | Amorphized barrier layer for integrated circuit interconnects | Minh Van Ngo, Minh Quoc Tran | 2002-02-19 |
| 6346472 | Manufacturing method for semiconductor metalization barrier | John A. Iacoponi | 2002-02-12 |
| 6346470 | Method for reducing electromigration in semiconductor interconnect lines | Takeshi Nogami | 2002-02-12 |
| 6344410 | Manufacturing method for semiconductor metalization barrier | Shekhar Pramanick, Dirk Brown | 2002-02-05 |
| 6340633 | Method for ramped current density plating of semiconductor vias and trenches | John A. Iacoponi | 2002-01-22 |