Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468894 | Metal interconnection structure with dummy vias | Suzette K. Pangrle | 2002-10-22 |
| 6410418 | Recess metallization via selective insulator formation on nucleation/seed layer | — | 2002-06-25 |
| 6410442 | Mask-less differential etching and planarization of copper films | — | 2002-06-25 |
| 6350678 | Chemical-mechanical polishing of semiconductors | Shekhar Pramanick | 2002-02-26 |
| 6350687 | Method of fabricating improved copper metallization including forming and removing passivation layer before forming capping film | Steven C. Avanzino, Sergey Lopatin, Todd P. Lukanc | 2002-02-26 |