Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489253 | Method of forming a void-free interlayer dielectric (ILD0) for 0.18-&mgr;m flash memory technology and semiconductor device thereby formed | Minh Van Ngo, Lu You, King Wai Kelwin Ko, Pei-Yuan Gao | 2002-12-03 |
| 6482755 | HDP deposition hillock suppression method in integrated circuits | Minh Van Ngo, Dawn Hopper | 2002-11-19 |
| 6465349 | Nitrogen-plasma treatment for reduced nickel silicide bridging | Minh Van Ngo, Christy Mei-Chu Woo, Paul R. Besser | 2002-10-15 |
| 6388330 | Low dielectric constant etch stop layers in integrated circuit interconnects | Minh Van Ngo, Dawn Hopper, Terri Jo Kitson | 2002-05-14 |
| 6383925 | Method of improving adhesion of capping layers to cooper interconnects | Minh Van Ngo, Lu You, Ercan Adem | 2002-05-07 |
| 6383880 | NH3/N2-plasma treatment for reduced nickel silicide bridging | Minh Van Ngo, Christy Mei-Chu Woo | 2002-05-07 |
| 6348410 | Low temperature hillock suppression method in integrated circuit interconnects | Minh Van Ngo, Dawn Hopper | 2002-02-19 |