Issued Patents 1997
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5688441 | Thixotropic conductive paste | Minehiro Itagaki, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura, Kazuyuki Okano | 1997-11-18 |
| 5670826 | Method for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the method | Yoshihiro Tomura | 1997-09-23 |
| 5662755 | Method of making multi-layered ceramic substrates | Kazuhiro Miura, Satoru Yuhaku, Yasuhiko Hakotani, Minehiro Itagaki, Yoshifumi Nakamura +1 more | 1997-09-02 |
| 5651179 | Method for mounting a semiconductor device on a circuit board | Yoshihiro Tomura | 1997-07-29 |
| 5641996 | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging | Kazunori Omoya, Takashi Oobayashi, Wataru Sakurai, Mitsuru Harada | 1997-06-24 |
| 5640051 | Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex | Yoshihiro Tomura, Yasuhiko Hakotani | 1997-06-17 |
| 5628919 | Methods for producing a chip carrier and terminal electrode for a circuit substrate | Yoshihiro Tomura, Yasuhiko Hakotani | 1997-05-13 |