Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5641996 | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging | Kazunori Omoya, Wataru Sakurai, Mitsuru Harada, Yoshihiro Bessho | 1997-06-24 |