Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5641996 | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging | Kazunori Omoya, Takashi Oobayashi, Mitsuru Harada, Yoshihiro Bessho | 1997-06-24 |
| 5594756 | Decision feedback equalization circuit | Hideki Sawaguchi, Naoki Satoh, Masuo Umemoto | 1997-01-14 |