Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5670826 | Method for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the method | Yoshihiro Bessho | 1997-09-23 |
| 5651179 | Method for mounting a semiconductor device on a circuit board | Yoshihiro Bessho | 1997-07-29 |
| 5640051 | Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex | Yoshihiro Bessho, Yasuhiko Hakotani | 1997-06-17 |
| 5628919 | Methods for producing a chip carrier and terminal electrode for a circuit substrate | Yoshihiro Bessho, Yasuhiko Hakotani | 1997-05-13 |