Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5688441 | Thixotropic conductive paste | Minehiro Itagaki, Yoshihiro Bessho, Satoru Yuhaku, Kazuhiro Miura, Kazuyuki Okano | 1997-11-18 |
| 5662755 | Method of making multi-layered ceramic substrates | Kazuhiro Miura, Yoshihiro Bessho, Satoru Yuhaku, Minehiro Itagaki, Yoshifumi Nakamura +1 more | 1997-09-02 |
| 5640051 | Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex | Yoshihiro Tomura, Yoshihiro Bessho | 1997-06-17 |
| 5628919 | Methods for producing a chip carrier and terminal electrode for a circuit substrate | Yoshihiro Tomura, Yoshihiro Bessho | 1997-05-13 |