Issued Patents 1997
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5691649 | Carrier having slide connectors for testing unpackaged semiconductor dice | Salman Akram, Mike Brooks | 1997-11-25 |
| 5686318 | Method of forming a die-to-insert permanent connection | Alan G. Wood | 1997-11-11 |
| 5686317 | Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die | Salman Akram, Alan G. Wood | 1997-11-11 |
| 5682065 | Hermetic chip and method of manufacture | Salman Akram, Alan G. Wood | 1997-10-28 |
| 5678301 | Method for forming an interconnect for testing unpackaged semiconductor dice | Derek Gochnour | 1997-10-21 |
| 5674785 | Method of producing a single piece package for semiconductor die | Salman Akram, Alan G. Wood | 1997-10-07 |
| 5663654 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood, Tim J. Corbett | 1997-09-02 |
| 5640762 | Method and apparatus for manufacturing known good semiconductor die | Alan G. Wood | 1997-06-24 |
| 5634267 | Method and apparatus for manufacturing known good semiconductor die | Alan G. Wood | 1997-06-03 |
| 5607818 | Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition | Salman Akram, David R. Hembree | 1997-03-04 |
| 5592736 | Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads | Salman Akram, Alan G. Wood | 1997-01-14 |
| 5593927 | Method for packaging semiconductor dice | Alan G. Wood, Trung T. Doan, John O. Jacobson | 1997-01-14 |