Issued Patents 1997
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5686318 | Method of forming a die-to-insert permanent connection | Warren M. Farnworth | 1997-11-11 |
| 5686317 | Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die | Salman Akram, Warren M. Farnworth | 1997-11-11 |
| 5682065 | Hermetic chip and method of manufacture | Warren M. Farnworth, Salman Akram | 1997-10-28 |
| 5674785 | Method of producing a single piece package for semiconductor die | Salman Akram, Warren M. Farnworth | 1997-10-07 |
| 5663654 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett, Warren M. Farnworth | 1997-09-02 |
| 5640762 | Method and apparatus for manufacturing known good semiconductor die | Warren M. Farnworth | 1997-06-24 |
| 5634267 | Method and apparatus for manufacturing known good semiconductor die | Warren M. Farnworth | 1997-06-03 |
| 5592736 | Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads | Salman Akram, Warren M. Farnworth | 1997-01-14 |
| 5593927 | Method for packaging semiconductor dice | Warren M. Farnworth, Trung T. Doan, John O. Jacobson | 1997-01-14 |