Issued Patents 1997
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5691649 | Carrier having slide connectors for testing unpackaged semiconductor dice | Warren M. Farnworth, Mike Brooks | 1997-11-25 |
| 5686317 | Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die | Warren M. Farnworth, Alan G. Wood | 1997-11-11 |
| 5682065 | Hermetic chip and method of manufacture | Warren M. Farnworth, Alan G. Wood | 1997-10-28 |
| 5674785 | Method of producing a single piece package for semiconductor die | Alan G. Wood, Warren M. Farnworth | 1997-10-07 |
| 5661334 | Inter-metal dielectric structure which combines fluorine-doped glass and barrier layers | — | 1997-08-26 |
| 5658818 | Semiconductor processing method employing an angled sidewall | Charles L. Turner, Alan Laulusa | 1997-08-19 |
| 5609995 | Method for forming a thin uniform layer of resist for lithography | Paul D. Shirley, William T. Rericha | 1997-03-11 |
| 5607818 | Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition | Warren M. Farnworth, David R. Hembree | 1997-03-04 |
| 5592736 | Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads | Warren M. Farnworth, Alan G. Wood | 1997-01-14 |