Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5678301 | Method for forming an interconnect for testing unpackaged semiconductor dice | Warren M. Farnworth | 1997-10-21 |
| 5653017 | Method of mechanical and electrical substrate connection | David A. Cathey, Charles M. Watkins | 1997-08-05 |