Issued Patents 1997
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5695601 | Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method | Masako Kodera, Shiro Mishima, Hiromi Yajima, Riichirou Aoki | 1997-12-09 |
| 5679059 | Polishing aparatus and method | Toyomi Nishi, Tetsuji Togawa, Harumitsu Saito, Manabu Tsujimura, Hiromi Yajima +7 more | 1997-10-21 |
| 5653623 | Polishing apparatus with improved exhaust | Norio Kimura, Seiji Ishikawa, Masako Kodera, Riichirou Aoki | 1997-08-05 |
| 5616063 | Polishing apparatus | Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Masako Kodera, Shirou Mishima +3 more | 1997-04-01 |
| 5597341 | Semiconductor planarizing apparatus | Masako Kodera, Hiroyuki Yano, Riichirou Aoki, Hiromi Yajima, Haruo Okano | 1997-01-28 |