Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5695601 | Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method | Masako Kodera, Atsushi Shigeta, Hiromi Yajima, Riichirou Aoki | 1997-12-09 |
| 5679059 | Polishing aparatus and method | Toyomi Nishi, Tetsuji Togawa, Harumitsu Saito, Manabu Tsujimura, Hiromi Yajima +7 more | 1997-10-21 |
| 5679063 | Polishing apparatus | Norio Kimura, You Ishii, Hozumi Yasuda, Koji Saito, Masako Watase | 1997-10-21 |