HT

Hans-Joerg Timme

SA Siemens Aktiengesellschaft: 3 patents #21 of 792Top 3%
KT Kabushiki Kaisha Toshiba: 2 patents #169 of 1,730Top 10%
IBM: 2 patents #396 of 3,557Top 15%
📍 Ottobrunn, NY: #1 of 1 inventorsTop 100%
Overall (1997): #15,959 of 185,788Top 9%
3
Patents 1997

Issued Patents 1997

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
5683945 Uniform trench fill recess by means of isotropic etching Klaus Penner 1997-11-04
5667622 In-situ wafer temperature control apparatus for single wafer tools Isahiro Hasegawa, Karl Paul Muller, Bernhard L. Poschenriedes, Theodore G. van Kessel 1997-09-16
5636258 In-situ temperature measurement using X-ray diffraction Katsuya Okumura, James G. Ryan, Gregory Brian Stephenson 1997-06-03