Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5667622 | In-situ wafer temperature control apparatus for single wafer tools | Isahiro Hasegawa, Bernhard L. Poschenriedes, Hans-Joerg Timme, Theodore G. van Kessel | 1997-09-16 |
| 5665622 | Folded trench and rie/deposition process for high-value capacitors | Wesley C. Natzle | 1997-09-09 |
| 5605600 | Etch profile shaping through wafer temperature control | Klaus Roithner, Bernhard Poschenrieder, Toru Watanabe | 1997-02-25 |
| 5592412 | Enhanced deep trench storage node capacitance for DRAM | Richard L. Kleinhenz, Klaus Roithner, Masakatsu Tuschiaki | 1997-01-07 |