Issued Patents 1997
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5682143 | Radio frequency identification tag | Michael John Brady, Thomas Anthony Cofino, Harley Heinrich, Glen Walden Johnson, Paul A. Moskowitz | 1997-10-28 |
| 5660921 | Poly (aryl ether benzimidazoles) their use capping layers in microelectronic structures | Kie Y. Ahn, James L. Hedrick, Jeffrey W. Labadie, Kang-Wook Lee, Robert J. Twieg +1 more | 1997-08-26 |
| 5635846 | Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih | 1997-06-03 |
| 5633047 | Electronic devices having metallurgies containing copper-semiconductor compounds | Michael John Brady, Curtis E. Farrell, Sung Kwon Kang, Jeffrey R. Marino, Donald Joseph Mikalsen +5 more | 1997-05-27 |
| 5600257 | Semiconductor wafer test and burn-in | James M. Leas, Robert William Koss, Charles H. Perry, Jody Van Horn | 1997-02-04 |
| 5599582 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole +4 more | 1997-02-04 |
| 5593720 | Process for making a multileveled electronic package | Kie Y. Ahn, James L. Hedrick, Jeffrey W. Labadie, Kang-Wook Lee, Robert J. Twieg +1 more | 1997-01-14 |