Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5635756 | Semiconductor device, lead frame therefor and memory card to provide a thin structure | Makoto Kitano, Asao Nishimura | 1997-06-03 |
| 5608265 | Encapsulated semiconductor device package having holes for electrically conductive material | Makoto Kitano, Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Naotaka Tanaka +1 more | 1997-03-04 |