Issued Patents 1997
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5637914 | Lead frame and semiconductor device encapsulated by resin | Naotaka Tanaka, Akihiro Yaguchi, Tatsuya Nagata, Tetsuo Kumazawa, Atsushi Nakamura +2 more | 1997-06-10 |
| 5635756 | Semiconductor device, lead frame therefor and memory card to provide a thin structure | Ryuji Kohno, Asao Nishimura | 1997-06-03 |
| 5621243 | Semiconductor device having thermal stress resistance structure | Noboru Baba, Hisanori Okamura, Masahiko Sakamoto, Hirosi Akiyama, Ryuichi Saito +4 more | 1997-04-15 |
| 5612569 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more | 1997-03-18 |
| 5608265 | Encapsulated semiconductor device package having holes for electrically conductive material | Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno, Naotaka Tanaka +1 more | 1997-03-04 |