Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5698790 | Method for measuring adhesion strength of resin material | Asao Nishimura, Isao Hirose | 1997-12-16 |
| 5637914 | Lead frame and semiconductor device encapsulated by resin | Akihiro Yaguchi, Makoto Kitano, Tatsuya Nagata, Tetsuo Kumazawa, Atsushi Nakamura +2 more | 1997-06-10 |
| 5608265 | Encapsulated semiconductor device package having holes for electrically conductive material | Makoto Kitano, Asao Nishimura, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno +1 more | 1997-03-04 |