Issued Patents 1997
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5698790 | Method for measuring adhesion strength of resin material | Naotaka Tanaka, Isao Hirose | 1997-12-16 |
| 5670793 | Semiconductor device having a polycrystalline silicon film with crystal grains having a uniform orientation | Hideo Miura, Shunji Moribe, Hisayuki Kato, Atsuyoshi Koike, Shuji Ikeda | 1997-09-23 |
| 5643805 | Process for producing a bipolar device | Hiroyuki Ohta, Hideo Miura, Hiroo Masuda, Yoichi Tamaki, Takahide Ikeda +1 more | 1997-07-01 |
| 5635756 | Semiconductor device, lead frame therefor and memory card to provide a thin structure | Ryuji Kohno, Makoto Kitano | 1997-06-03 |
| 5619069 | Bipolar device and production thereof | Hiroyuki Ohta, Hideo Miura, Hiroo Masuda, Yoichi Tamaki, Takahide Ikeda +1 more | 1997-04-08 |
| 5612569 | Semiconductor device | Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Ichiro Anjoh +19 more | 1997-03-18 |
| 5608265 | Encapsulated semiconductor device package having holes for electrically conductive material | Makoto Kitano, Akihiro Yaguchi, Nae Yoneda, Ryuji Kohno, Naotaka Tanaka +1 more | 1997-03-04 |