Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5608265 | Encapsulated semiconductor device package having holes for electrically conductive material | Makoto Kitano, Asao Nishimura, Akihiro Yaguchi, Ryuji Kohno, Naotaka Tanaka +1 more | 1997-03-04 |