Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5674780 | Method of forming an electrically conductive polymer bump over an aluminum electrode | William H. Lytle, Jong-Kai Lin, Ravinder K. Sharma, Naresh Saha | 1997-10-07 |
| 5661042 | Process for electrically connecting electrical devices using a conductive anisotropic material | Lih-Tyng Hwang, William Williams, III | 1997-08-26 |